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ULTRABOND® HYB-2CC
High Strength Concrete Anchoring Adhesive
For cracked and uncracked concrete, ULTRABOND® HYB-2CC is IBC approved for application in temperatures down to 23 °F. And for jobs where a quick cure rate is required, it will cure completely in 30 minutes at 70 °F. Approved...

EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.

EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.

DP 99
Spray Degalvanizer
DP 99 is a degalvanizing spray for use on roll-forming machines, shears, punch press dies and notchers. DP 99 will soften and loosen galvanizing debris while lubricating. Daily use will keep machinery clear of galvanizing build-up. DP 99...

20-1625
Silicone Potting System
Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration.
ULTRABOND® HYB-2CC
High Strength Concrete Anchoring Adhesive
For cracked and uncracked concrete, ULTRABOND® HYB-2CC is IBC approved for application in temperatures down to 23 °F. And for jobs where a quick cure rate is required, it will cure completely in 30 minutes at 70 °F. Approved...
EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.
DP 99
Spray Degalvanizer
DP 99 is a degalvanizing spray for use on roll-forming machines, shears, punch press dies and notchers. DP 99 will soften and loosen galvanizing debris while lubricating. Daily use will keep machinery clear of galvanizing build-up. DP 99...
20-1625
Silicone Potting System
Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration.


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