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EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping

ASI 57
Hybrid Polymer Sealant and Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...

EPC-OVERLAY
Epoxy Polymer Concrete Overlay
EPC-OVERLAY is an all-in-one, 100% solids, solvent-free, moisture-insensitive, high-performance, multi-purpose epoxy polymer concrete overlay system. This next generation system is easy-to-use and cost-effective, combining a low-modulus epoxy resin system with a high-quality engineered blend of graded aggregate to...

EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

ULTRABOND® 2
Ultrabond Epoxy
With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...

EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
ASI 57
Hybrid Polymer Sealant and Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...
EPC-OVERLAY
Epoxy Polymer Concrete Overlay
EPC-OVERLAY is an all-in-one, 100% solids, solvent-free, moisture-insensitive, high-performance, multi-purpose epoxy polymer concrete overlay system. This next generation system is easy-to-use and cost-effective, combining a low-modulus epoxy resin system with a high-quality engineered blend of graded aggregate to...
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
ULTRABOND® 2
Ultrabond Epoxy
With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...


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