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EPO-TEK® MED-H20E
Medical Grade Conductive Epoxy
ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use.

EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.

ACCU-CHOCK
Ultimate Strength Epoxy
ACCU-CHOCK is a two-component, high-performance, high early and ultimate strength epoxy machine chock for use in high bearing areas with negligible shrinkage and creep, fast cure and excellent flowability. If you have any more questions about Adhesives Technology...

EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

DP 2502
Fiberglass Duct Liner Adhesive
A premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. It can be used to seal cut edges of fiberglass duct liner. DP 2502 can also be used...
EPO-TEK® MED-H20E
Medical Grade Conductive Epoxy
ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use.
EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
ACCU-CHOCK
Ultimate Strength Epoxy
ACCU-CHOCK is a two-component, high-performance, high early and ultimate strength epoxy machine chock for use in high bearing areas with negligible shrinkage and creep, fast cure and excellent flowability. If you have any more questions about Adhesives Technology...
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.


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