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50-3170
Thermally Conductive Epoxy Rubber Repair Adhesive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
50-3141
Flame Retardant Epoxy Adhesive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
EPO-TEK® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
ASI 505
Industrial Grade Silicone Self Leveling
ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...
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