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EPO-TEK® H70E
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Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
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General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
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A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
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Medium hardness polyurethane with excellent dielectric strength and low toxicity. Also available as faster gelling versions 20-2183 and 20-2184. Softer Shore A Hardness versions available as 20-2101, 20-2140, and 20-2160.
ASI COMPOUND 70
Multi-Purpose Silicone Grease and Lubricant
ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.This stiff, tacky compound is non-melting and retains its properties over extended periods...
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