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10-3216
Impact Resistant Adhesive
Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.

CRACKBOND® JF
Polyurea Concrete Repair Joint Filler
This elastomeric, Polyurea joint filler (formerly known as JF-311) allows 10-15% movement of installed joint width and can be used in temperatures between -40 °F to 120 °F (-40 °C to 49 °C). Available in cartridges and in...

50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

EPO-TEK® MED-353ND
Medical Grade Epoxy Adhesive
ISO 10993 Medical grade high temperature high reliability epoxy. It has decades of use and reliability in medical device designs worldwide.

EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

DP 2501
Water Based Duct Liner Adhesive
A premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. It can be used to seal cut edges of fiberglass duct liner. DP 2501 can also be used...
10-3216
Impact Resistant Adhesive
Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.
CRACKBOND® JF
Polyurea Concrete Repair Joint Filler
This elastomeric, Polyurea joint filler (formerly known as JF-311) allows 10-15% movement of installed joint width and can be used in temperatures between -40 °F to 120 °F (-40 °C to 49 °C). Available in cartridges and in...
50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
EPO-TEK® MED-353ND
Medical Grade Epoxy Adhesive
ISO 10993 Medical grade high temperature high reliability epoxy. It has decades of use and reliability in medical device designs worldwide.
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...


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