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U-15
Moisture Barrier & Urethane Adhesive
U-15 is a 2 in 1 moisture control urethane wood flooring adhesive. U-15 is a superior formulation for the interior installation of all types of wood flooring over concrete. U-15 provides moisture protection for up to 15 lbs....

CRACKBOND® CSR
Low Viscosity Polyurethane For Fast Repair of Cracks and Spalls in Concrete
2-component polyurethane hybrid formulations. Extreme low viscosity and rapid cure for quick repairs of cracks and spalls in concrete. Find a selection of concrete repair and restoration adhesives for buildings and transportation infrastructure.

EPO-TEK® OE121 Black
Underfill Epoxy
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

EP75-SEAL
Urethane Sealant
Low-viscosity, low surface tension, penetrating healer/sealer.

EPO-TEK® T7109
Thermally Conductive Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

CRACKBOND® V120 LO-MOD
Epoxy Healer/Sealer (More Flexible Formula)
CRACKBOND® V120 LO-MOD is a two-component, moisture insensitive, low modulus, high strength epoxy healer/sealer penetrant, designed to seal micro cracks in bridge and parking structure decks and as an overlay for high friction surface treatment. The super-low viscosity...
U-15
Moisture Barrier & Urethane Adhesive
U-15 is a 2 in 1 moisture control urethane wood flooring adhesive. U-15 is a superior formulation for the interior installation of all types of wood flooring over concrete. U-15 provides moisture protection for up to 15 lbs....
CRACKBOND® CSR
Low Viscosity Polyurethane For Fast Repair of Cracks and Spalls in Concrete
2-component polyurethane hybrid formulations. Extreme low viscosity and rapid cure for quick repairs of cracks and spalls in concrete. Find a selection of concrete repair and restoration adhesives for buildings and transportation infrastructure.
EPO-TEK® OE121 Black
Underfill Epoxy
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
EP75-SEAL
Urethane Sealant
Low-viscosity, low surface tension, penetrating healer/sealer.
EPO-TEK® T7109
Thermally Conductive Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
CRACKBOND® V120 LO-MOD
Epoxy Healer/Sealer (More Flexible Formula)
CRACKBOND® V120 LO-MOD is a two-component, moisture insensitive, low modulus, high strength epoxy healer/sealer penetrant, designed to seal micro cracks in bridge and parking structure decks and as an overlay for high friction surface treatment. The super-low viscosity...


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