Downloads
Technical Data Sheet
Certifications
Related Products
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
CRACKBOND® JF
Polyurea Concrete Repair Joint Filler
This elastomeric, Polyurea joint filler (formerly known as JF-311) allows 10-15% movement of installed joint width and can be used in temperatures between -40 °F to 120 °F (-40 °C to 49 °C). Available in cartridges and in...
EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
10-3003 Series
High Peel Strength Epoxy
Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.
ASI 6900
Quick Grab Adhesive for Heavy Duty Applications
ASI 6900 Extreme Fast-Grab Hybrid Adhesive grabs and holds substrates within just a few seconds, making it ideal for holding heavy objects in place while adhesive cures to form a long-term, durable bond. This reduces or eliminates the...
Synthetic Latex Adhesives
Evans Adhesive's synthetic latex adhesives offer versatile, high-strength bonding for multiple applications, including building and construction, providing durability, flexibility, and excellent adhesion for a wide range of materials and surfaces.
Get in touch to learn more
Speak to us on 401-946-5564
Contact us