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EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
DP 1010
Water Based Duct Sealant
A premium grade, UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1010 allows for better coverage and ease of application....
EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
DP DUCT WRAP FILM
Polyethylene Protective Film for Duct
DP Wrap is a polyethylene film with a high-tack adhesive designed to provide protection from moisture, dust, debris, and paint. The film is easily removed, tear resistant and UV resistant.Covering round and rectangular duct during transportation, storage and...
EP50-SC
Fast-Setting, Low-Modulus Epoxy Polymer
EP50-SC (Standard Cure) is a moisture-insensitive, 100% solids epoxy polymer engineered for skid-resistant overlay systems and other demanding infrastructure applications. Designed to provide exceptional bond strength, high early strength, and long-term durability, EP50-SC delivers reliable performance on bridge...
THE CRACKER®
Concrete Breaking Powder
THE CRACKER® is a non-explosive cracking agent enabling standard demolition to be carried out with comparative accuracy. This system is virtually noiseless, vibration free and is ecologically friendly.Break Concrete With Concrete Demolition Powder-The Cracker
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