Certifications
Related Products

EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

ASI 0240
Adhesive Remover and Cleaner
ASI 0240 is a multi-use, sprayable liquid that can used when tooling sealants/caulk to more rapidly create a professional, clean looking seal. ASI 0240 also serves as a remover for all types of caulks, sealants, labels, capes and...

EPO-TEK® MED-353ND
Medical Grade Epoxy Adhesive
ISO 10993 Medical grade high temperature high reliability epoxy. It has decades of use and reliability in medical device designs worldwide.

EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping

DP 2501
Water Based Duct Liner Adhesive
A premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. It can be used to seal cut edges of fiberglass duct liner. DP 2501 can also be used...
EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
ASI 0240
Adhesive Remover and Cleaner
ASI 0240 is a multi-use, sprayable liquid that can used when tooling sealants/caulk to more rapidly create a professional, clean looking seal. ASI 0240 also serves as a remover for all types of caulks, sealants, labels, capes and...
EPO-TEK® MED-353ND
Medical Grade Epoxy Adhesive
ISO 10993 Medical grade high temperature high reliability epoxy. It has decades of use and reliability in medical device designs worldwide.
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping


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