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50-3170
Thermally Conductive Epoxy Rubber Repair Adhesive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
60-7185RCL
UV Curable Urethane Acrylate
Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.
HFP 1:1
Advanced Surface Polymer
HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.
EP50-OVERLAY
Low Modulus Polymer Resin Overlay
EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.
EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
EP100-SEAL LM
Low Viscosity Epoxy Sealer
EP100-SEAL LM is a highly penetrating, two-component epoxy healer/sealer.
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