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EPO-TEK® HYB-353ND-TX2
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A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
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Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
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Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
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Thixotropic Optical Epoxy Adhesive
Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.
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Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
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100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
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