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EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.
10-3216
Impact Resistant Adhesive
Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.
20-2175
Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
ASI 306
Electronic Grade Self-Leveling Silicone
ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
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