EPO-TEK® OG198-55 Thixotropic UV Epoxy

Features

High Tg, translucent UV cure epoxy
Electrically and thermally insulating
Strong transmission above 560 nm
UV shadow cure allows for enhanced performance after a thermal post cure and significant cure propagation into shadow area.

Applications

Active alignment of optics
Bonding fibers to V-grooves
Fiber pigtails
Alignment in optoelectronic hybrids Semiconductor devices
General bonding including structural adhesive in commercial LED lighting

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® OG198-55 Technical Data Sheet

File Size 899.5 KB

View

Safety Data Sheet

Document Name EPO-TEK® OG198-55 Safety Data Sheet

File Size 179.6 KB

View

Safety Data Sheet

Document Name EPO-TEK® OG198-55 Safety Data Sheet Syringe

File Size 180.3 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

E-mobility Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors

Market:

Automotive and Transportation Electronics Optical, Datacom and Telecom

Function:

Bonding

Related Products

Viewing options:

EPO-TEK® 320

Thixotropic Optical Epoxy Adhesive

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.

TDS

EPO-TEK® 353NDP

PROPEL FORWARD WITH EPO-TEK® 353NDP

Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

SDS TDS

EPO-TEK® 377H

Graphite Filled Bonding Epoxy

Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.

TDS

EPO-TEK® 930-4

Thermally Conductive Epoxy Adhesive

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.

TDS

EPO-TEK® H70S

Thermally Conductive Epoxy

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping

SDS TDS

EPO-TEK® HYB-353ND-LV

Low Viscosity UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

SDS TDS