EPO-TEK® 730 Black
General and Structural Grade Epoxy
This is a two component, room temperature curing, general and structural Grade epoxy resin. It can be used for adhesive and sealing applications in medical, x-ray device, filtration, opto-electronics, and PCB industries. It is a thixotropic, black version...
EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
EPO-TEK® 730-110 Black
Nonconductive Adhesive
Two component, room temperature curing general and structural grade epoxy. Can be used as an adhesive or for sealing and encapsulating applications in medical, X-Ray devices, filtration, opto-electronics, and PCB industries.
EPO-TEK® 921
High Tg,Thermally Conductive, Electrically Insulating Epoxy
Designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.
EPO-TEK® 921-FL
Thermally Conductive Epoxy
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for...
EPO-TEK® 930
Thermally Conductive Epoxy
Two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® B9021
B-Stage Epoxy
Single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach.
EPO-TEK® B9101-2 Unfilled
Nonconductive Adhesive
Single component, electrically and thermally insulating epoxy designed for adhesive, sealing, and potting of micro-electronics and semiconductor devices. Maybe used in industries such as military, automotive, optical, or medical electronics.
