EPO-TEK B9101-2 Unfilled Nonconductive Adhesive

EPO-TEK® B9101-2 Unfilled Nonconductive Adhesive

Single component, electrically and thermally insulating epoxy designed for adhesive, sealing, and potting of micro-electronics and semiconductor devices. Maybe used in industries such as military, automotive, optical, or medical electronics.

SDS TDS

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Technical Data Sheet

Document Name EPO-TEK® B9101-2 Unfilled TDS

File Size 83.1 KB

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Safety Data Sheet

Document Name EPO-TEK® B9101-2 Unfilled SDS

File Size 226.0 KB

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Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Market:

Aerospace and Defense Electronics Medical Optical, Datacom and Telecom

Function:

Bonding

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