EPO-TEK® H74
Thermally Conductive Epoxy
This thermally conductive epoxy is designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.
EPO-TEK® H77
Thermally Conductive, Electrically Insulating Epoxy
Designed for lid sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases, or ceramic.
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
EPO-TEK® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
EPO-TEK® HYB-353ND-TX2
UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
EPO-TEK® MED-301
Low Viscosity Medical Grade Epoxy
ISO 10993 Medical grade low viscosity clear epoxy with high spectral transmission.
EPO-TEK® MED-301-2
Optically Transparrent Medical Grade Epoxy Resin
ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.
EPO-TEK® MED-353ND
Medical Grade Epoxy Adhesive
ISO 10993 Medical grade high temperature high reliability epoxy. It has decades of use and reliability in medical device designs worldwide.
