EPO-TEK® OG198-55
UV Curable Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® T7109
Thermally Conductive Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
EPO-TEK® T7110
Thermally Conductive Adhesive
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
EPX50-OVERLAY
Polymer Resin
Moisture-insensitive, low-modulus epoxy-urethane co-polymer overlay resin.
EPX50-OVERLAY FAST
Setting Formulation
Fast setting, low -modulus, epoxy urethane co-polymer.
Finale®
Hard-Set, elastomeric Cove Base Adhesive
Cross the finish line first with Finale. With its immediate grab, Finale holds the pressure of inner and outer corners, allowing you to give your job site the final touch. Finale works flawlessly over multiple surfaces and has...
