EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
EPO-TEK® 301-2FL
Low Stress Optical Epoxy
This two-component solution is commonly used for potting, casting, and encapsulation, and is suitable for semiconductor applications like underfill for flip chips and glob top encapsulation. This adhesive is impact and vibration resistant, making it perfect for bonding...
EPO-TEK® 301-2FL-CX
Low Viscosity Optical Epoxy
This a two component optical epoxy low index version of EPO-TEK® 301-2FL. It features very low viscosity and excellent optical-mechanical properties.
EPO-TEK® 301-2FL-G
Low Stress, Optical Epoxy
EPO-TEK® 301-2FL-G is a two component optical and semiconductor grade epoxy resin. It is a version of EPO-TEK® 301-2FL with an indicator added for enhanced process control.
EPO-TEK® 301-2FL-LY
Optical Epoxy
A two-component, optical and semiconductor grade epoxy. It is a lower yellowing version of EPO-TEK® 301-2FL.
EPO-TEK® 301-2FL-MR
Optical Epoxy
A two-component, optical and semiconductor grade epoxy. It is a verion of EPO-TEK® 301-2FL with enhanced flexibility and compressibility.
EPO-TEK® 301-2FL-T
Optical Epoxy
A single-component, optical-grade, flexible epoxy resin; a thixotropic version of EPO-TEK® 301-2FL.
EPO-TEK® 301-2G
Optically Transparent Epoxy
A two-component version of EPO-TEK® 301-2 with added indicator for enhanced process control capabilities.
EPO-TEK® 302
Fast Setting, Optical Epoxy
This two component epoxy is a fast-gelling, room temperature curing epxoy, designed for electronics, optical and general applications. Due to its versatility, it may be used to adhere, seal, pot or encapsulate. Allows for % transmission in VIS...
