EPO-TEK® 920
High Tg, Thermally Conductive, Electrically Insulating Epoxy
This product is designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal...
EPO-TEK® 920-FL
Thermally Conductive Epoxy
This product is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920.
EPO-TEK® 921
High Tg,Thermally Conductive, Electrically Insulating Epoxy
Designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® B13181
Thermally Conductive Epoxy
A single component, thermally conductive, low-halogen, B-Stage epoxy paste.
EPO-TEK® E2101
Electrically Conductive, Silver Epoxy
A two component, thixotropic, electrically conductive adhesive.
EPO-TEK® EJ2108
Flexible, Silver-filled Adhesive
This is a two component flexible, silver-filled, electrically and thermally conductive low temperature curing adhesive.
EPO-TEK® EJ2189-LV
Electrically Conductive Epoxy
This is an electrically conductive silver-filled epoxy paste designed for low temperature curing from ambient to 80°C.
EPO-TEK® EJ2312
Room Temperature Curing ECA
Two component room temperature curing electrically conductive adhesive.
