EPO-TEK® 330 - Low Viscosity Optical Epoxy

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

CRACKBOND® EPOTHANE T3 is a low-modulus, epoxy urethane skid-resistant overlay. It may be successfully applied and cured at temperatures between 60 °F and 95 °F (16 °C and 35 °C). 

Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.

ULTRABOND® ASF-2000 is a domestically manufactured, two-component styrene free, acrylic adhesive used for anchoring and doweling applications in uncracked concrete with threaded rod and rebar. It is suitable for use in temperatures between 5 °F and 110 °F...