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60-7185RCL
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EPO-TEK® OE121
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Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
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MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...
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High Performance Epoxy Anchor Adhesive
ULTRABOND® EPX-3CC is everything you need, and nothing you don’t, because it’s the perfect balance between high performance and high volume. With an installation temperature range of 48 °F to 108 °F, and a full cure in 4...
DP 3030
Water Based Vapor Retarder
A water-based, premium quality, low odor, quick drying, water resistant, vapor retarder mastic for commercial and residential use. DP 3030 is bright white and is formulated to have excellent brush and trowel application properties. DP 3030 is recommended...
ULTRABOND® ASF-2000
Cold Weather Doweling Adhesive
ULTRABOND® ASF-2000 is a domestically manufactured, two-component styrene free, acrylic adhesive used for anchoring and doweling applications in uncracked concrete with threaded rod and rebar. It is suitable for use in temperatures between 5 °F and 110 °F...


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