EPO-TEK® 377
High Temperature, Fiber Optic Epoxy
EPO-TEK® 377 is a two-component, high Tg epoxy ideal for fiber optics, semiconductor, and optical applications. Its low viscosity ensures excellent handling and versatility in application methods, including encapsulating and potting. NASA-approved for low outgassing,
EPO-TEK® 383ND
High Temperature Optical Epoxy
EPO-TEK® 383ND is a two component, high temperature, electrically and thermally insulating epoxy. Designedas a longer pot life version of EPO-TEK® 353ND.
EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.
EPO-TEK® 730 Black
General and Structural Grade Epoxy
This is a two component, room temperature curing, general and structural Grade epoxy resin. It can be used for adhesive and sealing applications in medical, x-ray device, filtration, opto-electronics, and PCB industries. It is a thixotropic, black version...
EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
EPO-TEK® 730-110 Black
Nonconductive Adhesive
Two component, room temperature curing general and structural grade epoxy. Can be used as an adhesive or for sealing and encapsulating applications in medical, X-Ray devices, filtration, opto-electronics, and PCB industries.
EPO-TEK® 920
High Tg, Thermally Conductive, Electrically Insulating Epoxy
This product is designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal...
EPO-TEK® 920-FL
Thermally Conductive Epoxy
This product is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920.
EPO-TEK® 921
High Tg,Thermally Conductive, Electrically Insulating Epoxy
Designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.
