EPO-TEK® 430
Electrically Conductive Epoxy
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized.
EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.
EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
EPO-TEK® 920
High Tg, Thermally Conductive, Electrically Insulating Epoxy
This product is designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal...
EPO-TEK® 920-FL
Thermally Conductive Epoxy
This product is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920.
EPO-TEK® 921
High Tg,Thermally Conductive, Electrically Insulating Epoxy
Designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® B13181
Thermally Conductive Epoxy
A single component, thermally conductive, low-halogen, B-Stage epoxy paste.
EPO-TEK® E2101
Electrically Conductive, Silver Epoxy
A two component, thixotropic, electrically conductive adhesive.
