EPO-TEK® 383ND - High Temperature Optical Epoxy

ULTRABOND® EPX-3CC is everything you need, and nothing you don’t, because it’s the perfect balance between high performance and high volume. With an installation temperature range of 48 °F to 108 °F, and a full cure in 4...

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

ASI 504 Multi-Purpose Silicone can be used as both a sealant and adhesive for a variety of applications requiring a waterproof seal. It Is a paste-like, one component acetoxy silicone that cures to form a durable solid rubber...

EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach.  It can also be used for semiconductor and high temperature ceramic and vauum packaging.

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.