EPO-TEK® 377 - High Temperature, Fiber Optic Epoxy

A medium viscosity, premium quality, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5050 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...

ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

Pentra-Sil® (C&N) cleans and neutralizes concrete floors that suffer from surface sweating and efflorescence. This first step of a two-part treatment stabilizes the alkalinity in concrete surfaces by infusing lithium ions throughout the substrate.

EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.