ASI 55
Multi-Purpose Hybrid Sealant & Adhesive
ASI 55 Industrial & Construction Hybrid Sealant/Adhesive uses ASI’s innovative hybrid technology to provide a one part, elastomeric sealant/adhesive that will perform in a variety of demanding environments and applications without degrading.Unlike conventional polyurethanes and solvent based sealants/...
ASI 57
High Performance Hybrid Sealant & Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...
EPO-TEK® EK1000
Electrically & Thermally Conductive Epoxy
High thermal conductive silver filled adhesive.
EPO-TEK® H20E
Electrically & Thermally Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
EPO-TEK® H20E-HC
Electrically & Thermally Conductive Epoxy
High thermal conductivity version of EPO-TEK® H20E.
EPO-TEK® OG142-87
UV Curable Epoxy
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
