10-3004NC
Low Viscosity, Adjustable Flexibility Epoxy Adhesive
10-3004NC is a high bond strength epoxy adhesive, with a non-critical mix ratio and adjustable flexibility. 10-3004NC yields high peel strength and excellent tensile strength. It also has outstanding thermal shock, impact and vibration resistance. This high-performance epoxy...
10-3006
Non-Sag Patch & Repair Epoxy System
10-3006 is a non-sag fast setting patch & repair epoxy system and is dry to the touch in 5-10 minutes.
10-3009NC
Low Viscosity Epoxy Adhesive & Potting Compound
10-3009 NC is a low viscosity epoxy adhesive and potting compound. This product offers a good combination of peel and tensile strength. 10-3009 NC provides electrical insulation and outstanding adhesion.
10-3013
Instant Setting Cyanoacrylate Adhesive
10-3013 is a medium viscosity, instant setting Ethyl Cyanoacrylate adhesive. This fast-setting adhesive is formulated for the bonding of plastics, rubbers, paper, metals, and other common substrates.
10-3020
Fast Cure Thixotropic Epoxy Adhesive
10-3020 is part of the 10-3005 series and is a high bond strength adhesive. 10-3020 has a quick setting time of 20 minutes at room temperature. It is excellent for bonding plated metals, glass, wood, ceramic, felt, cement,...
10-3046
Fast Cure Thixotropic Epoxy Adhesive
46-minute set, high bond strength epoxy ideal for electrical, industrial, structural, and jewelry applications. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3005 series (5-minute set) and the 10-3020 series (20-minute set).

Emulsion Adhesives
Evans Adhesive's emulsion adhesives deliver versatile, high-performance bonding solutions, offering strong, reliable adhesion and flexibility for a wide range of industrial and packaging needs.

Hot Melt Adhesives
Evans Adhesive's hot melt adhesives provide fast-setting, durable bonds for packaging and converting industries, offering reliable performance, efficient application, and strong adhesion to meet the demands of high-volume production environments.


















