EPO-TEK® 301-2FL

EPO-TEK® 301-2FL Low Stress Optical Epoxy

This two-component solution is commonly used for potting, casting, and encapsulation, and is suitable for semiconductor applications like underfill for flip chips and glob top encapsulation. This adhesive is impact and vibration resistant, making it perfect for bonding optics in OEM and scientific instruments.

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Safety Data Sheet

Document Name EPO-TEK® 301-2FL

File Size 442.2 KB

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Technical Data Sheet

Document Name EPO-TEK® 301-2FL

File Size 558.0 KB

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Epoxy Technology

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