EPO-TEK® 301-2FL-G - Low Stress, Optical Epoxy

A medium viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 can be used for bonding and coating jackets of canvas, glass cloth and...

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

A multi-purpose, pressure sensitive, clear, industrial strength aerosol spray adhesive with quick tack and high shear strength. DP 77 is provided in convenient and easy to use aerosol cans. DP 77 is used to adhere fiberglass duct liner...

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

Medium hardness polyurethane with excellent dielectric strength and low toxicity. Also available as faster gelling versions 20-2183 and 20-2184. Softer Shore A Hardness versions available as 20-2101, 20-2140, and 20-2160.

CRACKBOND® V120 LO-MOD is a two-component, moisture insensitive, low modulus, high strength epoxy healer/sealer penetrant, designed to seal micro cracks in bridge and parking structure decks and as an overlay for high friction surface treatment. The super-low viscosity...