EPO-TEK® 310M - Flexible Optical Epoxy

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. 

ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.

With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...