EPO-TEK® 353ND-T Black - High Temperature Thixotropic Epoxy

ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.

EPX50LT-OVERLAY is a moisture-insensitive, low-modulus, epoxy urethane co-polymer overlay resin, designed to be applied in late season cold conditions down to 30 °F and rapid return to service applications.

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.