EPO-TEK B9126-7 Thermally Conductive Epoxy Adhesive

EPO-TEK® B9126-7 Thermally Conductive Epoxy

Single component, thermally and electrically conductive epoxy adhesive designed for semiconductor die attach and circuit assembly applications. It has a low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs, PCBs, and substrates.

SDS TDS

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Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® B9126-7 TDS

File Size 87.8 KB

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Safety Data Sheet

Document Name EPO-TEK® B9126-7 SDS

File Size 448.2 KB

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Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Market:

Electronics

Function:

Bonding

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