EPO-TEK® EK1000-1-D - Silver Conductive Epoxy

Concrete weare surface extender with anti-scaling treatment.

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

EP100-SEAL HM is a highly penetrating, two-component epoxy healer/sealer.

Smooth, non-sag, non-abrasive consistency ideal for use in bulk dispensing systems without adverse wear on pumps. Extensive DOT approvals. Available in cartridges and bulk with ATC. 

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.