EPO-TEK® H20E-8 - Electrically Conductive Adhesive

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

2-component polyurethane hybrid formulations. Extreme low viscosity and rapid cure for quick repairs of cracks and spalls in concrete. Find a selection of concrete repair and restoration adhesives for buildings and transportation infrastructure.

Concrete weare surface extender with anti-scaling treatment.

A low viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. The lower viscosity of DP 3060 makes it an ideal lap adhesive for pipe insulation...

DP Wrap is a polyethylene film with a high-tack adhesive designed to provide protection from moisture, dust, debris, and paint. The film is easily removed, tear resistant and UV resistant.Covering round and rectangular duct during transportation, storage and...