EPO-TEK® H20E-LC

EPO-TEK® H20E-LC Electrically Conductive Adhesive

EPO-TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is the conductive adhesive of choice for low chloride applications.

SDS TDS

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Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® H20E-LC TDS

File Size 573.3 KB

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Safety Data Sheet

Document Name EPO-TEK® H20E-LC SDS

File Size 310.2 KB

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Brand:

Epoxy Technology

Technology:

Epoxy

Market:

Electronics

Function:

Bonding

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