EPO-TEK® H31 - Electrically Conductive Adhesive

ASI 504 Multi-Purpose Silicone can be used as both a sealant and adhesive for a variety of applications requiring a waterproof seal. It Is a paste-like, one component acetoxy silicone that cures to form a durable solid rubber...

EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach.  It can also be used for semiconductor and high temperature ceramic and vauum packaging.

Transil® 244(+) is a premium Nano-Lithium® hardener, densifier, and hydrophobic sealer ideal for protecting concrete and masonry surfaces against damage from freeze-thaw cycles, moisture, and chloride ion intrusion.

ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...

Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.

Pentra-Sil® (H) provides efficient and economic maximum densification for large format industrial warehouses and data centers. This lithium silicate “time of placement” reactive densifier significantly reduces wear due to abrasion while eliminating concrete dusting, and makes the surface...