EPO-TEK® H31 - Electrically Conductive Adhesive

ASI 6900

Quick Grab Adhesive for Heavy Duty Applications

ASI 6900 Extreme Fast-Grab Hybrid Adhesive grabs and holds substrates within just a few seconds, making it ideal for holding heavy objects in place while adhesive cures to form a long-term, durable bond. This reduces or eliminates the...

EPO-TEK® OE121

Underfill Epoxy Adhesive

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

Emulsion Adhesives

Evans Adhesive's emulsion adhesives deliver versatile, high-performance bonding solutions, offering strong, reliable adhesion and flexibility for a wide range of industrial and packaging needs.

Synthetic Latex Adhesives

Evans Adhesive's synthetic latex adhesives offer versatile, high-strength bonding for multiple applications, including building and construction, providing durability, flexibility, and excellent adhesion for a wide range of materials and surfaces.

EPO-TEK® 301

Low Viscosity Optical Grade Epoxy

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

70-3812NC

Aluminum Filled Epoxy

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.