EPO-TEK® H67-MP

Features

Complies with the requirements of MIL-STD 883/Method 5011
Yields low levels of water extractable ions such as chlorides
Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-seal processes near 300°C, and organic burn-in up to 150°C/1000 hours storage
Available in different viscosity ranges

Applications

Widely used epoxy; popular choice for non-silver-filled die-attach epoxies; opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT
Die-attach for small chips such as GaAs, LEDs and diodes, as well as SMDs
Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® H67-MP TDS

File Size 559.6 KB

View

Safety Data Sheet

Document Name EPO-TEK® H67-MP SDS

File Size 338.3 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Microelectronics/Semiconductors

Market:

Aerospace and Defense Electronics

Function:

Bonding Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

DP 3050 HV

High Viscosity Water Based Lagging Adhesive

A high viscosity, premium quality, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 HV can be used for bonding and coating jackets of canvas, glass cloth and other...

SDS TDS

CONVERGENT STRiON:FORTIFY

Spray On Concrete Densifier

STRiON:Fortify is a revolutionary new method of concrete densification and hardening. Using groundbreaking new silica-free technology, STRiON relies on an ionic transfer process to disperse deep into concrete to make it more resilient, resistant to traffic, dustproof, easy...

SDS TDS

EP-SLV

Low Viscosity Exposy Adhesive

EP-SLV is a 100% solids, high-modulus, moisture-insensitive, very low-viscosity epoxy adhesive for gravity feed or pressure injection of cracks in concrete. EP-SLV is a structural repair adhesive designed primarily for pressure injection and gravity feed crack repair in...

TDS

ACCU-GROUT LE

Precision Epoxy for Construction Use

ACCU-GROUT products are three-component, pre-proportioned, industrial grade epoxy grouting systems. ACCU-GROUT is a general construction epoxy grout which is also available in high-strength (ACCU-GROUT HD) and low exotherm (ACCU-GROUT LE) formulations.

SDS TDS

DP 1040

Premium Butyl Gasket Sealant Tape

A premium quality, ZERO VOC, 100% solids, UL Classified, high pressure/high velocity butyl gasket tape for commercial and residential supply and return air duct uses. DP 1040 provides a flexible seal between TDC, TDF and applied flange connections...

SDS TDS