EPO-TEK® H70E-2 - Thermally Conductive, Electrically Insulating Epoxy

Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.

With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...

High thermal conductive silver filled adhesive.

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

EPX50-OVERLAY FAST is a fast-setting, moisture-insensitive, low-modulus, two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as a binder...

Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration.