EPO-TEK® H81 - Electrically Conductive Adhesive

ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.

EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach.  It can also be used for semiconductor and high temperature ceramic and vauum packaging.

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

A water-based, premium quality, low odor, quick drying, water resistant, vapor retarder mastic for commercial and residential use. DP 3030 is bright white and is formulated to have excellent brush and trowel application properties. DP 3030 is recommended...

General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.