EPO-TEK® H81 - Electrically Conductive Adhesive

Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant. 

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.

2-component polyurethane hybrid formulations. Extreme low viscosity and rapid cure for quick repairs of cracks and spalls in concrete. Find a selection of concrete repair and restoration adhesives for buildings and transportation infrastructure.

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

Highly thixotropic epoxy with non-flowing properties and high temperature resistance. 

A high viscosity, premium quality, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 HV can be used for bonding and coating jackets of canvas, glass cloth and other...