EPO-TEK® HYB-353ND-TX3 - High Temperature Hybrid Epoxy

Hot Melt Adhesives

Evans Adhesive's hot melt adhesives provide fast-setting, durable bonds for packaging and converting industries, offering reliable performance, efficient application, and strong adhesion to meet the demands of high-volume production environments.

EP-CLEARSEAL

High Gloss Clear Epoxy Sealant

EP-CLEARSEAL is a two-component, moisture-insensitive, self priming, impermeable, high-gloss epoxy sealer that exhibits excellent bond strength. EP-CLEARSEAL uses a cycloaliphatic amine curing system for color retention and chemical resistance.

Emulsion Adhesives

Evans Adhesive's emulsion adhesives deliver versatile, high-performance bonding solutions, offering strong, reliable adhesion and flexibility for a wide range of industrial and packaging needs.

EPO-TEK® OE121 Black

Underfill Epoxy Adhesive

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

EPO-TEK® H20S

Silver Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

EPO-TEK® 930-4

Thermally Conductive Epoxy Adhesive

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.