EPO-TEK® MED-OG198-54 - UV & UV Hybrid

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

A medium viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 can be used for bonding and coating jackets of canvas, glass cloth and...

ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...

CRACKBOND® JF-90 HD is a two component, moisture insensitive heavy duty epoxy joint filler and crack filling material. Its semi-rigid design allows for use in industrial floors exposed to hard-wheeled forklift traffic. It shaves easily and may be...

Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.

EP-CLEARSEAL is a two-component, moisture-insensitive, self priming, impermeable, high-gloss epoxy sealer that exhibits excellent bond strength. EP-CLEARSEAL uses a cycloaliphatic amine curing system for color retention and chemical resistance.