Certifications
Related Products

DP 3060
Low Viscosity Lagging Adhesive
A low viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. The lower viscosity of DP 3060 makes it an ideal lap adhesive for pipe insulation...

ULTRABOND® HARD-ROK
Concrete Strength Anchoring Adhesive
For anchoring threaded rod and rebar, railings, sign posts and parking meters, or patching holes and cracks in roads and sidewalks, ULTRABOND® HARD-ROK contains no metals to cause rust or stains and is suitable for interior or exterior...

EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

EP-GEL FAST
Non-sag, high-modulus, high-strength doweling gel
EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications.

EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

EPO-TEK® 353NDP
Hi-Rel Optical Epoxy
Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...
DP 3060
Low Viscosity Lagging Adhesive
A low viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. The lower viscosity of DP 3060 makes it an ideal lap adhesive for pipe insulation...
ULTRABOND® HARD-ROK
Concrete Strength Anchoring Adhesive
For anchoring threaded rod and rebar, railings, sign posts and parking meters, or patching holes and cracks in roads and sidewalks, ULTRABOND® HARD-ROK contains no metals to cause rust or stains and is suitable for interior or exterior...
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
EP-GEL FAST
Non-sag, high-modulus, high-strength doweling gel
EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications.
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® 353NDP
Hi-Rel Optical Epoxy
Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact usEPO-TEK® OD2002
High Tg Optical EpoxyLet's talk
We're here to help you create the perfect product.















