Certifications
Related Products

CRACKBOND® 2300 GEL
High Strength Gel Bonding Adhesive
CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

EP-SLV
Low Viscosity Exposy Adhesive
EP-SLV is a 100% solids, high-modulus, moisture-insensitive, very low-viscosity epoxy adhesive for gravity feed or pressure injection of cracks in concrete. EP-SLV is a structural repair adhesive designed primarily for pressure injection and gravity feed crack repair in...

ULTRABOND® ASF-2000
Cold Weather Doweling Adhesive
ULTRABOND® ASF-2000 is a domestically manufactured, two-component styrene free, acrylic adhesive used for anchoring and doweling applications in uncracked concrete with threaded rod and rebar. It is suitable for use in temperatures between 5 °F and 110 °F...

DP 2502
Fiberglass Duct Liner Adhesive
A premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. It can be used to seal cut edges of fiberglass duct liner. DP 2502 can also be used...

DP 1030
Water Based Duct Sealant
A UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1030 allows for easier sealing of holes and gaps often...
CRACKBOND® 2300 GEL
High Strength Gel Bonding Adhesive
CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
EP-SLV
Low Viscosity Exposy Adhesive
EP-SLV is a 100% solids, high-modulus, moisture-insensitive, very low-viscosity epoxy adhesive for gravity feed or pressure injection of cracks in concrete. EP-SLV is a structural repair adhesive designed primarily for pressure injection and gravity feed crack repair in...
ULTRABOND® ASF-2000
Cold Weather Doweling Adhesive
ULTRABOND® ASF-2000 is a domestically manufactured, two-component styrene free, acrylic adhesive used for anchoring and doweling applications in uncracked concrete with threaded rod and rebar. It is suitable for use in temperatures between 5 °F and 110 °F...
DP 2502
Fiberglass Duct Liner Adhesive
A premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. It can be used to seal cut edges of fiberglass duct liner. DP 2502 can also be used...
DP 1030
Water Based Duct Sealant
A UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1030 allows for easier sealing of holes and gaps often...


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