EPO-TEK® OG116-31 - UV Curable Epoxy

Edit Epo Tek Og116 31 Main Product Carousel Image

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

SDS TDS
Brand:
Epoxy Technology
Technology:
Epoxy
Application:
Consumer Electronics and PCBA Datacom and Telecom Microelectronics/Semiconductors Optical Sensors and Camera Modules
Market:
Electronics Optical, Datacom and Telecom
Function:
Bonding Encapsulation Potting and Encapsulation Sealing

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:
50-3141

50-3141

Thermally Conductive

Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

SDS
TDS
View product
EPO-TEK® 930-4

EPO-TEK® 930-4

Thermally Conductive Adhesive

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. 

SDS
TDS
View product
60-7111RCL

60-7111RCL

UV Curable

Non-yellowing UV urethane adhesive and encapsulant.

SDS TDS
View product
50-3152FR

50-3152FR

Thermally Conductive

Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

SDS
TDS
View product
EPO-TEK® 323LP

EPO-TEK® 323LP

Optical Grade Epoxy

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.

SDS
TDS
View product
EPO-TEK® H37-MP

EPO-TEK® H37-MP

Electrically & Thermally Conductive Epoxy

Low stress and low temperature cure temperature version of H35-175MP.

View product

Get in touch to learn more

Speak to us on 1-978-667-3805

Contact us