EPO-TEK® OG116-31

Features

A single component, UV curable epoxy adhesive and encapsulant
High Tg and low outgassing are indicative of its high temperature performance
Viscosity/rheology adapted to high volume syringe needle dispensing with no tailing
Versatility in cure. Product responds to a broad range of UV light, and secondary thermal post-curing

Applications

Semiconductor: COB glob top covering IC’s and wire bonds; glob top dam; encapsulating and sealing; adhesion to FR4, Kapton, silicon
Fiber Optic: making fiber optic pigtails; active alignment of optics; adhesion to many types of glass, metals, ceramics and plastics
Opto-electronic: Perimeter/main seal for LCD’s, compatible with VAN liquid crystal for LCoS devices

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® OG116-31 TDS

File Size 745.8 KB

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Safety Data Sheet

Document Name EPO-TEK® OG116-31 SDS

File Size 275.3 KB

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Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA Datacom and Telecom Microelectronics/Semiconductors Optical Sensors and Camera Modules

Market:

Electronics Optical, Datacom and Telecom

Function:

Bonding Encapsulation Potting and Encapsulation Sealing

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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