Features
- A single component, UV curable epoxy adhesive and encapsulant
- High Tg and low outgassing are indicative of its high temperature performance
- Viscosity/rheology adapted to high volume syringe needle dispensing with no tailing
- Versatility in cure. Product responds to a broad range of UV light, and secondary thermal post-curing
Applications
- Semiconductor: COB glob top covering IC’s and wire bonds; glob top dam; encapsulating and sealing; adhesion to FR4, Kapton, silicon
- Fiber Optic: making fiber optic pigtails; active alignment of optics; adhesion to many types of glass, metals, ceramics and plastics
- Opto-electronic: Perimeter/main seal for LCD’s, compatible with VAN liquid crystal for LCoS devices
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

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Speak to us on 1-978-667-3805
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