EPO-TEK® OG116 - Epoxy-Based Thermal Post Cure

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications. 

Pentra-Guard® (EXT) is a protective exterior sealer for concrete, masonry and stone surfaces. It seals and protects against dirt, grime, salt and oil damage while enhancing natural color and shine. Ideal for colored concrete, walkways, patios and pavers....

ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...

CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...

Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.