EPO-TEK® OG154-1 - UV Optical Cure

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates.  Its flexibility allows bonding to substrates with high coefficients of thermal expansion.

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

Pentra-Pel™ (SI) is a penetrating lithium stain guard designed for interior or exterior concrete, stone and masonry surfaces. This product creates a protective barrier that resists staining. It densifies, seals, and repels while maintaing breathability and doesn’t alter...

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.