EPO-TEK® OG198-55-1 - UV & UV Hybrid

Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

A premium quality, low viscosity, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5060 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...

Premium quality, solvent based, fast drying, non-flammable liquid adhesive, pressure sensitive fiberglass duct liner insulation adhesives. They are supplied in convenient spray canister systems which are both portable and cost effective. DP 2590 CA is available as a...

EP15-GROUT by E-Chem is a three-component, 100% solids, high-performance, epoxy machine grout designed for high-stress machine base plate grouting applications in the heavy industrial equipment industries. New equipment installations or quick re-grouting applications subject to chemical attack and...

Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.