EPO-TEK® OJ2116 - Nonconductive Adhesive

Pentra-Finish™ (HG) is an advanced, high-gloss, fast-drying lithium sealer that creates a microfilm on polished concrete, stone, terrazzo, masonry and other cementitious surfaces. This easy-to-use finish increases shine, enhances color and improves resistance against abrasion and stains. Pentra-Finish™...

EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach.  It can also be used for semiconductor and high temperature ceramic and vauum packaging.

This elastomeric, Polyurea joint filler (formerly known as JF-311) allows 10-15% movement of installed joint width and can be used in temperatures between -40 °F to 120 °F (-40 °C to 49 °C). Available in cartridges and in...

EPX50-OVERLAY FAST is a fast-setting, moisture-insensitive, low-modulus, two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as a binder...

EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications. 

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping