EPO-TEK® OM118 - Nonconductive Epoxy Adhesive

XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.

A premium quality, ZERO VOC, 100% solids, UL Classified, high pressure/high velocity butyl gasket tape for commercial and residential supply and return air duct uses. DP 1040 provides a flexible seal between TDC, TDF and applied flange connections...

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

ASI 55 Industrial & Construction Hybrid Sealant/Adhesive uses ASI’s innovative hybrid technology to provide a one part, elastomeric sealant/adhesive that will perform in a variety of demanding environments and applications without degrading.Unlike conventional polyurethanes and solvent based sealants/...

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

100% solids, semi-rigid, epoxy joint filler.