EPO-TEK® OM118 - Nonconductive Epoxy Adhesive

High thermal conductivity version of EPO-TEK® H20E.

10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates.  Its flexibility allows bonding to substrates with high coefficients of thermal expansion.

XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.

With extensive DOT approvals, ULTRABOND® HS-200 is ideal for anchoring threaded rod, bolts and rebar dowels into concrete. With a long working time of 24 minutes and multiple embedment depth design tables, this anchoring epoxy offers a 2:1...

ASI 504 Multi-Purpose Silicone can be used as both a sealant and adhesive for a variety of applications requiring a waterproof seal. It Is a paste-like, one component acetoxy silicone that cures to form a durable solid rubber...

CRACKBOND® BRIDGE-GARD is a multi-purpose epoxy polymer concrete overlay system designed for high-stress infrastructure applications. It may be successfully applied and cured at temperatures between 65 °F and 95 °F (18 °C and 35 °C).