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EP-MV
Medium Viscosity Concrete Bonding Adhesive
EP-MV is a 100% solids, two-component, high-modulus, medium-viscosity, moisture-insensitive structural epoxy adhesive designed for bonding freshly mixed concrete to hardened concrete, for bonding hardened concrete to hardened concrete and other materials, and as a binder for epoxy mortars....

50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

60-7155RCL
UV Curable Potting Epoxy Resin
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.

EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

DP 2502
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A premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. It can be used to seal cut edges of fiberglass duct liner. DP 2502 can also be used...
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EP-MV
Medium Viscosity Concrete Bonding Adhesive
EP-MV is a 100% solids, two-component, high-modulus, medium-viscosity, moisture-insensitive structural epoxy adhesive designed for bonding freshly mixed concrete to hardened concrete, for bonding hardened concrete to hardened concrete and other materials, and as a binder for epoxy mortars....
50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
60-7155RCL
UV Curable Potting Epoxy Resin
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...


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