EPO-TEK® P10

EPO-TEK® P10 Silver Die Attach Polyimide

A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging.

SDS TDS

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Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® P10 TDS

File Size 85.3 KB

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Safety Data Sheet

Document Name EPO-TEK® P10 SDS

File Size 375.3 KB

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Brand:

Epoxy Technology

Market:

Electronics

Function:

Bonding

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