EPO-TEK® T6067

EPO-TEK® T6067 Thermally Conductive Epoxy

A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.

SDS TDS

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Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® T6067 TDS

File Size 458.7 KB

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Safety Data Sheet

Document Name EPO-TEK® T6067 SDS

File Size 338.4 KB

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Brand:

Epoxy Technology

Technology:

Epoxy

Market:

Electronics

Function:

Thermal Transfer

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