EPO-TEK® T7109-19 - Flexible Thermally Conductive Epoxy

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

A premium grade, UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1010 allows for better coverage and ease of application....

CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...

CRACKBOND® JF-90 HD is a two component, moisture insensitive heavy duty epoxy joint filler and crack filling material. Its semi-rigid design allows for use in industrial floors exposed to hard-wheeled forklift traffic. It shaves easily and may be...

Polymer modified Portland cement blend of specialty aggregates and admixtures. Provides rapid setting, high strength, durable, concrete repairs. 

ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...