EPO-TEK® TJ1104-LH - Low Halogen Thermally Conductive Epoxy

CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...

CRACKBOND® 2100 MV (Medium Viscosity, a product formerly known as ULTRABOND® 2100) and 2100 MV-LPL (Medium Viscosity – Long Pot Life) products are two-component, high-strength epoxy adhesives that are ideal for bonding fresh to hardened concrete or perfect...

This elastomeric, Polyurea joint filler (formerly known as JF-311) allows 10-15% movement of installed joint width and can be used in temperatures between -40 °F to 120 °F (-40 °C to 49 °C). Available in cartridges and in...

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration. 

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.